Haoyu Yang

Ph.D Candidate
Department of Computer Science and Engineering
The Chinese University of Hong Kong

E-mail: hyyang[at]cse.cuhk.edu.hk
Office: Rm913, Ho Sin Hang Engineering Building
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About

I'm currently a final-year PhD student working with Prof. Bei Yu. Before joining CUHK, I received my Bachelor Degree of Integrated Circuit Design and Integrated Systems from Tianjin University. My research interests include Machine Learning in VLSI Design and Signoff. [My Resume] [Google Scholar]

Teaching

  • 2019Spring: CENG3420

  • 2018Spring: CENG3420

  • 2017Fall: CSCI0000

  • 2017Spring: CENG3420

  • 2016Fall: CENG4480

Paper Review/External Review

  • Elsevier Signal Processing

  • International Journal of Machine Learning and Cybernetics (JMLC)

  • IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD)

  • ACM Transactions on Design Automation of Electronic Systems (TODAES)

  • ACM Great Lakes Symposium on VLSI (GLSVLSI)

  • IEEE Transactions on Sustainable Computing (TSUSC)

  • IET Cyber-Physical Systems: Theory & Applications

  • IEEE ACCESS

  • ACM/IEEE Design Automation Conference (DAC)

News

  • 07-06-2019: Three papers are presented at the 56th Design Automation Conference, Las Vegas, NV

  • 28-02-2019: I am awarded the 2019 Nick Cobb Memorial Scholarship by SPIE and Mentor Graphics (SPIE-News) (CUHK-News)

  • 22-01-2019: I received the best poster award in Student Research Forum in ASPDAC 2019 (Photos)

  • 08-07-2018: Start summer intern at Cadence Design Systems Inc, San Jose, CA

  • 28-06-2018: Our paper was presented in the 55th Design Automation Conference, San Francisco, CA

  • 04-09-2017: Start intern at ASML Brion, San Jose, CA

  • 21-06-2017: One paper was presented in the 54th Design Automation Conference, Austin, TX

  • 01-03-2017: One paper was presented in the SPIE Advanced Lithography Conference, San Jose, CA

Experience

Peking University, China

  • Visiting Researcher

  • July 2019 – Oct 2019

Cadence Design Systems, CA, USA

  • Software Engineering Intern

  • July 2018 – Oct 2018

ASML Brion, CA, USA

  • Data Scientist Intern

  • Sept 2017 – Nov 2017

The Chinese University of Hong Kong, Hong Kong SAR

  • Research Assistant

  • March 2016 – July 2016, Hong Kong SAR